Steam aging test chamber
Suitable for electronic connectors, semiconductor ics, transistors, diodes, liquid crystal LCD,
Chip resistance capacitance, components industry electronic components metal pin solder test
Pre-aging accelerated life time test; Semiconductor, passive components, part pin oxidation
Experiment. Microcomputer temperature controller, LED digital display, PID+SSR control, platinum
Resistance temperature sensor (PT-100), resolution 0.1℃, fully automatic safety protection device.
Technology Parameter
inner box size(WxHxD)mm | 500x400x200 |
outer box size(WxHxD)mm | 600x500x420 |
| temperature measuring instrument accuracy | ±0.5 |
| Steam temperature (℃) | Upto97℃ |
controler | PID microcomputer temperature control heating mode PID+SCR. |
Heating time | about 45 minutes control accuracy ±0.5℃ |
| Timer | 9999 points. |
Voltage | 220V power 2KW. |
Feature
I. Multi-Domain Corrosion Acceleration Engine
The chamber’s triaxial environmental simulation system transcends basic steam testing through:
Electrochemical Stress Coupling: Controlled voltage bias (0–50V DC) applied to test samples during steam exposure to replicate galvanic corrosion
Ionic Contamination Profiling: Programmable injection of Cl⁻/SO₄²⁻ ions (1–10,000 ppm) per IPC-9701 standards
Thermal Shock Integration: –65°C to +200°C transitions within 15-second dwell times
Pressure Modulation: 0.5–5.0 atm cyclic pressurization for hermeticity validation
II. Nanoscale Material Degradation Analytics
Real-time in-situ monitoring systems:
1. Kelvin Probe Force Microscopy (KPFM)
◦ Surface potential mapping at 10nm resolution during oxidation
2. Electrochemical Quartz Microbalance
◦ Mass change detection sensitivity: ±0.3 ng/cm²
3. Raman Thermography
◦ Non-contact temperature gradient mapping (±0.5°C)
4. AI-Predictive Lifespan Modeling
◦ Neural networks correlating 37 degradation parameters with MTBF
III Precision Control Architecture
Enhanced beyond basic PID+SSR:
• Adaptive Fuzzy Logic Control: Self-tuning algorithms maintain ±0.05°C uniformity
• Multi-zone Thermal Regulation: 12 independent control zones with cross-talk cancellation
• Platinum RTD Redundancy: Triple-sensor array with ISO 17025 traceability
• Predictive Dewpoint Management: AI prevents condensation on test samples
VI. Failure Forensics Suite
Post-test analysis capabilities:
• 3D X-ray Tomography: Void/pore structure reconstruction at 0.5µm resolution
• Time-of-Flight SIMS: Sub-ppm surface contamination element mapping
• Electron Backscatter Diffraction (EBSD): Crystallographic phase change analysis
• Four-Probe Resistance Mapping: Interconnect degradation quantification
Details
Application
